Wafer Spacer

Tyvek® for Interleaf/Wafer Spacer offers excellent protection for delicate electronic devices.

Key challenges: for the semi-conductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Vacuum manipulation could also be a challenge. Wafer packaging solution provider, integrated circuit (IC) design company, have been looking for improved packaging solutions to address these common issues.

Values that Tyvek® can provide:

• Tear resistance to help secure the protection between wafers
• Low linting and smooth surface can help avoid particles and scratching
• Anti-static treatment can help minimize ESD (Electrostatic Discharge)
  

Tyvek® Styles:
Tyvek® 1025D, 1056D